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When the
COM-HPC customary was first mooted in 2019, there was, understandably, some preliminary concern out there over its potential affect on COM Specific Sort 6 and seven modules. This rapidly dissipated as soon as the specification turned clear. In spite of everything, they had been at all times meant to be complementary requirements and clearly differentiated with respect to efficiency, general function units, and worth stage.
However with the rising alternative of COM-HPC merchandise now out there, how do you select between these and people primarily based on the
long-established COM Express COM standard?
COM Specific is likely nonetheless the best platform to make use of when:
- The efficiency stage and reminiscence capability match the appliance necessities – processor TDP as much as 60 W – reminiscence capability as much as 128 GB
- A smaller footprint and thermal restrict are needed
- Extending the longevity of an current COM Specific answer to save lots of funding and guarantee continuity
- There’s a low to medium finances consideration
COM-HPC, however, is extra prone to be viable when:
- Processor energy is required past 60 W TDP
- Reminiscence capability should transcend the restrict of 128 GB
- Quicker interfaces comparable to USB 4.0, PCIe Gen 4/5 or 25Gbit Ethernet (permitting 100GbE interfaces) are required
- To accommodate the above, a bigger footprint and worth stage are accepted
Which Client Module?
COM-HPC /Client modules are positioned above
COM Express Sort 6 for a variety of embedded purposes – the place the priorities are elevated processing and graphics capabilities, quicker information transmission, and community connectivity.
- Energy envelope as much as 150W
- As much as 48 + 1 PCI Specific Gen4/5 lanes
- As much as 4 graphics interfaces
- As much as 2x 25 Gb Ethernet interfaces
- Module sizes: A: 95 x 120 mm; B: 120 x 120 mm; C: 160 x 120 mm
For instance,
COM-HPC Client Modules Sort A and C can be utilized successfully in a spread of high-end embedded consumer merchandise requiring a number of shows. Typical makes use of are in networking, automation, measurement, and AI purposes for medical tools, high-end instrumentation, industrial tools, on line casino gaming tools, ruggedized area PCs, transportation, and protection methods.
Deciding between COM Specific and COM-HPC on your embedded tasks? Whereas COM Specific fits purposes with particular efficiency and finances constraints, COM-HPC excels in high-performance eventualities, particularly in AI, Machine Studying, and 5G.
COM Specific Sort 6 addresses many embedded purchasers’ wants by providing a broad vary of I/O interfaces for graphics, Digital Show Interfaces (DisplayPort, HDMI, LVDS, or eDP), and super-fast USB 3.1. It’s subsequently geared up to serve many utility necessities throughout varied market segments. Embedded options producers have helped this by providing important purposes pre-integrated on provider boards and customized interfaces.
All needed performance is available on the single board stage. COM Specific Sort 6 additionally provides extensive scalability with compact and primary dimension type elements and a confirmed potential to make use of processors with a TDP (thermal design energy) of fifty watts or extra.
What about Server Modules?
COM Specific Sort 7 is a well-liked alternative to be used in server-grade edge platforms the place excessive information throughput is crucial. The pin-out is a complementary specification to the prevailing Sort 6 pin-out, changing graphics assist with a number of 10GbE-KR ports and defining 32 PCIe lanes.
COM-HPC Server modules A and D., however, provide even increased scalability, compute, and communications efficiency. These are meant for very high-performance edge server-class purposes with huge information volumes at stake, requiring real-time evaluation and transmission.
Artificial Intelligence, Machine Studying, and Deep Studying are typical examples, together with autonomous driving and 5G. That is the place COM-HPC servers’ elevated processing efficiency and larger connectivity come to the fore.
- Energy envelope as much as 300W
- As much as 64 + 1 PCI Specific Gen4/5 lanes
- No graphic interfaces
- As much as 8x 25 Gb Ethernet interfaces enabling 100Gb Ethernet
- Module sizes: D: 160 x 160 mm; E: 200 x 160 mm
To be taught which COM is true on your subsequent embedded mission, go to Kontron.com
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